U 90 Interface Mtl

U 90 thermal interface material where contamination concerns prohibit the use of silicone-based thermal pads, but where high levels of thermal conductivity are needed

MH&W International

February 21st, 2010

Ceramic-filled polyurethane film
Thermal conductivity of 6.0 W/mK
Thermal impedance of just 0.05 Kin2/W
High voltage breakdown property of 4.0 kV
Strong perforation protection with a tensile strength of 2.5 N/mm2 and a Shore A hardness of 70
Available in 0.100 and 0.200 mm thicknesses

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